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1 Title of the Article Behavior of Compacted Clayey Soils Mixed with Copper Slag
2 Author's name Nausheena Reshi: M. Tech Scholar, Department of Civil Engineering, RIMT University, Mandi Gobingarh, Punjab, India
3 Author's name Er. Ashish Kumar
4 Subject Civil Engineering
5 Keyword(s) CBR, OMC, MDD, UC, Oxidation filtration.
6 Abstract

As we all know that day by day the dumping of wastes becomes a challenge for civil Engineers. We can’t dump wastage at everywhere into the soil but after a lot of research it has been concluded that we can mix the wastage of various elements with the soil in a specified proportion in order to enhance the geotechnical properties of soil. In this thesis work we have taken copper slag and mix it with the soil to stabilize it. We have replaced the soil by copper slag by 10%, 20%, 30% and 40% respectively. After proper sampling we have done three tests on every sample such as CBR Test, Optimum Moisture Content (OMC) & Maximum Dry Density (MDD) Test and Unconfined Compression Test (UC). After the testing we have observed that Optimum Moisture Content decreases continuously with the replacement of soil by copper slag while Maximum Dry Density Increases continuously. Similarly, both soaked and un-soaked CBR test values increase with the addition of copper slag. Unconfined compression test increases rapidly initially but after 20% replacement it increases gradually. The result has been shown both numerically and graphically in this thesis work.

7 Publisher Innovative Research Publication
8 Journal Name; vol., no. International Journal of Innovative Research in Computer Science & Technology (IJIRCST); Volume-10 Issue-3
9 Publication Date May 2022
10 Type Peer-reviewed Article
11 Format PDF
12 Uniform Resource Identifier https://ijircst.org/view_abstract.php?title=Behavior-of-Compacted-Clayey-Soils-Mixed-with-Copper-Slag&year=2022&vol=10&primary=QVJULTEwMTA=
13 Digital Object Identifier(DOI) 10.55524/ijircst.2022.10.3.46   https://doi.org/10.55524/ijircst.2022.10.3.46
14 Language English
15 Page No 276-281

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